Should I build my own computer?

Oh, I thought I read somewhere that was a good video card. Because this rigs primary source will be gaming, just on a budget

 

Sorry, senior's moment, got my model numbers mixed up. (I'm so used to being an nVidia guy, I only recently switched to ATI when I got fed up with flaky nVidia cards.) The 5770 actually isn't half bad. I have the 5870, which is a great gaming card, though about twice as spendy as the 5770. Yeah, the 5770 will do fine on a budget as long as you aren't maxing your Crysis settings.

 

I just want Starcraft 2 on high, Im looking at the XFX Radeon HD 5830, 1 Gb now though. Though I figure once I get to college and find a job I can spend a little more on a graphics card later in life.

 

Yeah, the good part is you can always upgrade that later, and when you do you can sell your current card to help pay into the new one.

 

Thats why Im quite anxious to build this, and I think it will be a great learning experience....and ill feel cool! Ish.

Another question, after I put a cpu fan on the processor, can I remove it to upgrade either the fan or the processor?

 

Yes, but it's fussy. There are two types of HSFs that I've encountered.

1. The lever type:


These go on pretty easily once you have it correctly hooked over the tab of the mounting plate. Removal is generally just pushing the lever to unlatch it and then twisting the lever in the opposite direction.

Then there's the regular slotted style:


This flavour has a slot into which you need to shove a small, flat screwdriver into in order to push the HSF bracket over the tab on the CPU mounting bracket to snap it in place.

Removal requires you to push the screwdriver into the slot, push down and out to unlatch the bracket, and then lifting up.

In either case the thermal pad is going to be relatively sticky so it may take some rocking back and forth to unstick from the CPU. Don't force it! Keep working it until it comes off.

When reattaching it, remember to remove all of the thermal paste/pad residue from both the bottom of the HSF and the top of the CPU. Use a little bit of isopropyl alcohol on a cloth. You can use a little napthalene (lighter fluid) or toluene (found in products like Goo Gone or Goof Off), just be careful with it. Toluene in particular is raunchy stuff (it'll dissolve styrofoam in seconds), but awesome at removing sticky residue. (And inks and paints, too.) Once removed, apply some fresh thermal paste -- not a lot, but enough that it'll cover the surface of the CPU when the HSF squishes it down, and again, no bubbles. Bubbles are bad.

 

Awesome! Thanks for the info on that! Because I'm also thinking of upgrading the processor and then to some liquid cooling when I'm not relying on graduation/birthday money!

 

I haven't gotten into liquid cooling. I don't O/C so I've never seen the point. My case has tons of air cooling already so I can't justify the expense.

 

I can see myself o/cing in the future, but for now, I don't see the need. But, I like keeping the option open! Options, upgrades and customization is why I'm going for this

 

I'm all for customization, but overclocking has never struck me as beneficial. Sure, you can squeeze a few hundred extra Mhz with moderate extra cooling, maybe even an extra GHz with solid liquid cooling, but the practical benefits (not a great deal of practical speed increase) have never outweighed the risks (messing up and burning something out, shortened lifespan of components if you do get it right) for me. To be honest, there's nothing I do that can't stand waiting a few extra minutes for if my chances of frying something go down.

 

A valid point...but 2.8 is so close to 3